Research Page of Ka-Meng Lei
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Chip Reported in 2025

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Wire-Metal-based temp. sensor (CMOS 28nm, ISSCC'25)
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Single-Crystal Dual-Output Frequency Reference with Adaptive Calibration (CMOS 65nm, TCAS-II'25)
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ULV RxO with Dual SB-RC Network (CMOS 65nm, TCAS-I'25)
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Ultra-low-voltage DFLL (CMOS 65nm, TCAS-II'25)
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Cell sensing CMOS IC (CMOS 350nm, Adv. Sci. '25)
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Low-voltage RxO featuring Double Capacitor-Charging Headroom (CMOS 65nm, ISCAS'25)
Avenida de Universidade
Research Building N21 3015f
Taipa, Macau
P: +853-8822-4432
E: [email protected]

© Ka-Meng Lei 2025
  • Home
  • Biography
  • Team
  • Research
    • CMOS Micro-NMR/MRI Platform
    • Precision Analog Circuits for IoT
  • Achievement
    • Publication, Presentation, and Patent
    • Awards
    • Chip Gallery >
      • 2026
      • 2025
      • 2024
      • 2023
      • 2022
      • 2021 and before
  • Get in Touch
  • Useful Resources